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Intel chip architect Su Fei returns to China after 20 years in the US

After nearly two decades shaping Intel’s chip designs, one of its leading semiconductor architects has left the United States to join Tsinghua University as a full-time professor. Su Fei, a veteran engineer in chip testing and semiconductor reliability, is now the Xing-Hua endowed chair professor at his alma mater’s school of integrated circuits, according to the faculty webpage. At Intel, Su’s work spanned the entire chip life cycle – from early concept to mass production – with a focus on...


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